Avnet Silica to sell Octavo Systems’ system-in-packages


“System-in-package technology is an increasingly important tool in the field of electronic design,” said Avnet director Lucio Fornuto. “Access to Octavo’s solutions will enable our customers to take advantage of significant savings in the product development process, in their supply chains and their overall total cost of ownership.”

OSDZU3 modules get their processing power from a Xilinx ZU3 Zynq UltraScale+ IC with, alongside programmable logic, four 1.2GHz Arm Cortex-A53 cores, two 500MHz Cortex-R5F cores and a Mali-400 GPU.

Also within the module is up to 2Gbyte of LPDDR4, QSPI flash, eeprom and power management.

The parts are 20.5 x 40mm and connect through 1mm pitch 20 x 30 ball grid array.

“In addition, the agreement provides access to many other system-in-package devices across the Octavo portfolio,” according to Avnet.





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